Heterogeneous Electronics – Wafer Level Integration, Packaging, and Assembly Facility

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Security Lab

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Description

This facility integrates active electronics with microelectromechanical (MEMS) devices at the miniature system scale. It obviates current size-, weight-, and power (SWaP)-constrained integration challenges associated with ultra-compact and low observable chip-scale systems by integrating, at the wafer-level, small-scale MEMS devices with diverse components and materials, including active silicon and wideband gap switching devices. The facility's high density component integration tools include electroplating baths for electro-deposition of various metals; high precision pick and place tools; wafer dicing saws; ink-jet printing tools;wire bonders; flip-chip bonders; and a jet vapor tool for depositing various metals. Hybrid integration capabilities apply widely to areas such as miniature power supplies; secure communication systems, including small radios; imaging; and distributed and multi-modal sensor platforms.

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