Available Technology

ALKALINE ELECTROLYTE FOR DEFECT-FREE SUPERFILLING OF SUBMICROMETER DAMASCENE FEATURES

We have invented an electrodeposition process that permits defect-free copper electrodeposition from base (here pH 12) electrolytes into sub-micrometer features, including demonstration in trenches, to form interconnects from microelectronics. Such cability is required for future technologies where electrolyte resistivity must increase along with the electrical resistivity of the thinning copper seed on the 300 mm silicon wafers that provides electrical connectivity during copper electrodeposition to fill the pre-patterned damascene featured.
Inventors: 
Daniel Josell, Thomas Moffat
Patent Number: 
14/812,134
Internal Laboratory Ref #: 
14-023
Phone: 
301-975-2573
Email: 
tpo@nist.gov
Lab Representatives
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