Photolithography and Micro-Fabrication/ Packaging Laboratories

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Description

The Photolithography and Micro-Fabrication/Packaging laboratories provide research level semiconductor processing equipment and facilities that do not require a full cleanroom environment. Photolithography facilities include a photoresist spinner, optical mask aligner, a developing hood, curing ovens, a plasma asher, and a profilometer in a yellow-room environment. Micro-fabrication and packaging facilities include thermal and electron-beam evaporators; solvent and acid hoods; an electroplating hood; an automatic dicing saw; flip-chip indium bump bonders; wire bonders; optical inspection microscopes; and a probe station with a semiconductor parameter analyzer for electrical characterization.

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