Mechanical

available technology

ALLOY AND PROCESS FOR MAKING AND USING SAME

This disclosure describes a white copper alloy consisting of (by mass) 18-21 % Ni, 24-28 % Zn, up to 1.0 % Mn, <0.2 % Fe, unavoidable impurity elements in concentrations <0.1 %, and a balance of Cu, with properties desirable for use in currency applications. Specifically, after appropriate...
available technology

ARTICLE AND PROCESS FOR MODIFYING LIGHT

An article to perform surface plasmon resonance imaging includes a light source to provide source light, the source light including a source optical profile, the source optical profile being selected to match a transmission profile at a surface plasmon resonance angle; an optical transformer...
ARTICLE AND PROCESS FOR SELECTIVE DEPOSITION
available technology

ARTICLE AND PROCESS FOR SELECTIVE DEPOSITION

Currently, a density gradient in silicon can be made by deep reactive ion etching or dicing a silicon wafer with a dicing saw. However, these methods provide a relatively course gradient and are not suited for creating a density gradient in a curved surface. Additionally, chemical vapor deposition...
ARTICLE AND PROCESS FOR SELECTIVE ETCHING
available technology

ARTICLE AND PROCESS FOR SELECTIVE ETCHING

The ability to affordably fabricate complex 3D geometry on the nanoscale is critical to the development and commercialization of numerous emerging technologies. For example, technologies such as chiral photonics for advanced communication and nanofluidics for Lab-on-a-Chip applications benefit from...

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