Members Area
eGroups
About
Who We Are
Mission and Vision
Our History
Executive Board
Agency Reps
Committees
Regional and Deputy Regional Coordinators
National Advisory Council
FLC Staff
Policies & Bylaws
2023 Election Results
What We Do
FLC's Strategic Plan
FLC Services
Membership
About Our Members
Membership FAQ
Lab Rep Guide
Community Directory
What is Tech Transfer?
From Lab to Market
Watch Our T2 Video!
For the Media
FLC Press Releases
FLC Media Kit
FLC in the News
Share Your Lab's News
Contact Us
Engage
Ways to Engage
Overview
Labs Seeking Partners
Partners Seeking Labs
FLC's Regions
Region Overview
Far West
Mid-Atlantic
Mid-Continent
Midwest
Northeast
Southeast
Our Strategic Partners
FLEX Program
FLEX Program Overview
FLEX Lab and University Partners
Educate
FLC Education
FLC Learning Center
T2 Resources
Directors' Toolkit
FLC Green Book
Desk Reference
T2 Mechanisms
Terms to Know
T2 Playbook
Careers
Career Paths
Job Search
Highlights
Awards
Program Overview
2024 FLC Awards
Honors Gallery
Awards Publications
FLC Harold Metcalf Service Award
Labs in Action
Overview
Story Gallery
Fed Lab News
FLC Digest Newsletter
FLC Publications
FLC Planner
Annual Reports
Lab Tech In Your Life
Overview
Lab Tech at Home
Lab Tech in Flight
Video Library
Events
Upcoming Events
Calendar View
Industry and Tech Events
Lab Showcase
Member Connect
Webinars
2024 National Meeting
Green Energy Expo
AMOGY
Baker Hughes
BGS
Carrier
COnovate
ePower
Hexalayer
Oxicool
Samsung Advanced Institute of Technology- America and Samsung Semiconductor
Samsung, Virtual Property Division
USABC
Washington Gas
FLC Business
About FLC Business
How to Search
Search FLC Business
Notice of Intent to License
FLC Business FAQs
2024 National Meeting
Honors Gallery
Highlights
/
Awards
/
Biodegradable Molded Packing and Insulation Board Products from Cotton Gin Byproducts
Biodegradable Molded Packing and Insulation Board Products from Cotton Gin Byproducts
Award:
Excellence in Technology Transfer
Year:
2011
Award Type:
Region:
Laboratory: