Available Technology

Binary or Higher Order High-Density Thermodynamically Stable Nanostructured Copper-Based Tantalum Metallic Systems, and Methods of Making the Same

Patent Number: 
Patent number 9,333,558; Appl. No.: 13/779,803
Patent Status: 
Active
Patent Issue Date: 
May 10, 2016
Email: 
ORTA@arl.army.mil
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