Available Technology

METHOD OF FABRICATING HIGH-DENSITY HERMETIC ELECTRICAL FEEDTHROUGHS USING INSULATED WIRE BUNDLES

This technology discloses a method of fabricating electrical feedthroughs using multiple electrically conductive wires, which are covered with an electrically insulating material that bundles the coated wires together in a substantially parallel arrangement. 

The bundled coated wires are secured to each other by joining the electrically insulating material of adjacent wires together to form a monolithic block which is then cut transverse to the wires to produce a block section having opposing first and second sides with many electrically conductive feedthroughs extending between them. This process forms a hermetic electrically conductive feedthrough construct with an array of electrical feedthroughs extending between the first and second sides of the substrate. 

This technology provides a scalable fabrication method for producing high-density, bio-compatible, hermetic electrically conductive feedthroughs in a range of substrate thicknesses. Additionally, this process improves the hermetic bond between feedthrough and insulator by using a lower temperature process for insulator sealing. 

Contact: Yash Vaishnav, Vaishnav1@llnl.gov 

applications 

These disclosed inventions may find use in retinal/neural prostheses, cochlear implants, deep brain stimulation, tissue stimulation and monitoring, cortical implants, electrocorticography, and peripheral nervous system implants.

Additionally, these technologies provide methods for the fabrication of any device requiring a hermetic seal: pacemakers and other implants, use in the semiconductor industry, separating sensors from harsh field environments, within the broader packaging industry, and sealing toxic components from the environment.

Patent Number: 
9,333,337
Technology Type(s): 
Hermetic Seals
Internal Laboratory Ref #: 
IL12403
Patent Issue Date: 
August 30, 2018
Lab Representatives
Share to Facebook Share to Twitter Share to Google Plus Share to Linkedin