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Description
The Reliability Physics / Failure Analysis Laboratory performs
reliability assessments and failure analysis studies of electronic
components and systems. These include discrete, integrated and
hybrid electronic components both active and passive, subassemblies
and assemblies including printed wiring boards, solder joints and
interconnects, mechanical systems including single components,
timers and S & A's, electro-mechanical components and systems,
and optical and electro-optical components and systems.
The Reliability Physics / Failure Analysis Laboratory provides
excellent capabilities. The Scanning Electron Microscope (SEM),
equipped with both wavelength and energy dispersive spectrometers,
enables the observation of microstructures and performs full
elemental (both qualitative and quantitative) analysis. The SEM can
produce images with resolutions as fine as 4nm. The laboratory
contains all the equipment required to sample preparation and
surface analysis, including high quality optical microscopes,
carbon and gold coaters and a dedicated machine shop. Coupled with
other fine facilities in the A&IFD Laboratories, this lab can
perform a number of analytical techniques in the area of
semi-conductor failure analysis, such as voltage contrast and
current induced failure detection. In the voltage contrast mode, a
suspect device can be lowered while being examined with the
microscope. All positively charged metalization runs will appear
dark while negatively charged runs will appear light. While
functioning, isolation of defective areas can easily be
accomplished.