Available Technology

Tailored mesh susceptors for uniform induction heating, curing and bonding of materials

Mesh susceptors for use in induction heating and bonding processes are tailored to obtain more uniform heating across the susceptor and hence, the bondline, when bonding composite parts. The susceptors are tailored by cutting and removing segments from the mesh areas where the induced current and hence, heat generation, is highest. An algorithm is employed to predict the induced current patterns throughout the mesh so that areas of high heat generation can be identified and then cut and removed. In this way, essentially uniform temperatures in metal mesh susceptors may be achieved by specifically designed cut patterns within the mesh even though the mesh susceptor is subject to non-uniform magnetic fields.
Patent Number: 
Patent Issue Date: 
March 28, 2000
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